Shanghai Yuanji Micro recently launched the world’s first 8-inch 2D semiconductor pilot line – also the industry’s first engineering-scale 2D process line, covering the full flow from 2D material preparation to chip integration with complete wafer prototyping capability. The company aims to use this line to develop a 5nm-equivalent chip solution without EUV lithography by 2029.

Silicon-based advanced nodes face mounting leakage, heat, and cost challenges as scaling continues, with heavy reliance on EUV and complex FinFET/GAA structures. In contrast, 2D materials – with atomically thin channels – suppress tunneling leakage naturally, reducing power consumption without complex 3D architectures. They are well-suited for edge AI, RF, specialty sensors, flexible/transparent electronics, and quantum computing R&D.

By H2 2026, Yuanji Micro plans to achieve 90nm-equivalent 2D process capability, transitioning from lab samples to industrial-standard development. The long-term target for 2029 is a fully domestic 2D process matching 5nm silicon performance – entirely EUV-free.

Concurrently, Yuanji released a 500nm PDK v0.1 for the 8-inch platform, the first 2D PDK compatible with mainstream EDA tools, and opened foundry prototyping services. The library includes full Pcell, DRC, LVS, and PEX components, with reported yield above 99.99% – supporting wafer-level trials for circuits up to 100,000 transistors.

Industry forecasts project the global 2D semiconductor market at $30–50 billion by 2035, capturing 10–15% of the advanced chip segment – positioning 2D materials as a major post-Moore complementary path to silicon.

From ICgoodFind: No EUV, no problem? The first 8-inch 2D line is proof that materials innovation can rewrite the process roadmap. It’s still early, but the 99.99% yield number is already turning heads.